The optical inspection of patterned wafers can employ bright-field illumination, dark-field illumination, or a combination of both for defect detection. Patterned wafer inspection systems compare the image of a test die on the wafer with that of an adjacent die (or of a "golden" die known to be defect free).
High end Wafer ID Readers for single wafer tracking by reading the ID codes like Barcode, OCR Codes (optical characterization), Datamatrix codes or QR Codes. Additionally we also offer Batch Wafer Reader and automatic Wafer Alignment (notch).
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The leadframe is a thin metal plate part to be used in semiconductor packages such as IC, LSI, etc. While it supports and fixes an IC chip, its other role is to function as connection pins when the chip is mounted on a printed wiring board.
A lead frame is a thin layer of metal that is utilized in the semiconductor device assembly process. It is used to connect the large-scale circuitry on circuit boards and electrical devices to the tiny electrical terminals etched on the surface of the semiconductors.
Verify solder joints have adequate solder fillets, there is good solder flow. Surface may appear slightly grainy. Solder joint not contain unmelted solder balls and/or have cracks. Solder joints should not be gray in color.
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